ASML

Latest about ASML

Rebrickable version of ASML TWINSCAN EXE:5000 Lego kit
ASML's employee-only High-NA EUV Lego kit gets an open 810-piece fan replica

By Jowi Morales Published

A Lego enthusiast recreated the rare ASML Lego kit, added their own customizations, and shared the plans for free on Rebrickable.

Tech Industry
China startup demoes prototype EUV light source

By Anton Shilov Published

And will not demo one for many years to come.

Semiconductors
3D Render of a microchip-shaped China
EU negotiates sanction swap with China to rescue critical ASML supplier

By Etiido Uko Published

The EU is reportedly negotiating with Beijing to remove Chinese restrictions on German ASML supplier Sindlhauser Materials, to prevent the China-dependent company from going out of business

Semiconductors
ASML reports record $13 billion quarter, vows to expand capacity as demand for lithography equipment soars

By Anton Shilov Published

Premium ASML vows to expand production capacity amid growing demand, record earnings and profitability.

Premium
ASML
ASML struggling to keep up with demand for chipmaking equipment as AI spending continues to boom

By Etiido Uko Published

ASML to increase prices starting in 2027

Semiconductors
Elon Musk's Terafab will reportedly receive its first EUV tool from ASML in mid-2027

By Anton Shilov Published

Elon Musk may prefer FEL light sources for in-house chip production, but Terafab will start with proven tech from ASML.

Semiconductors
China stockpiled 343 immersion DUV tools for advanced chipmaking

By Anton Shilov Published

Centre for Technology & Statecraft (CTS) calls for banning exports of all immersion DUV tools to China, echoes the MATCH Act by U.S. legislators.

Semiconductors
ASML says it sold 'absolutely nothing' in Europe in 2026

By Anton Shilov Published

ASML calls EU authorities to help create demand for European chips as Europe's share in its revenue drops to 0% in 2026.

Semiconductors
Analyst firm says ASML unlikely to back particle accelerator chipmaking tech

By Anton Shilov Published

With progress that ASML makes with its LPP EUV light sources for its scanners, the company is barely interesting in adopting particle accelerator-based FEL sources.

Semiconductors
TSMC to start using High-NA EUV lithography in 2030

By Anton Shilov Published

TSMC discloses plans to use High-NA EUV lithography in 2030, 6×12-inch photomasks with new scanners in 2033.

Semiconductors
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