ASM

🌍 Net zero by 2035 isn't just a target. It's a roadmap built on action, accountability, and collaboration. In our updated Climate Transition Plan, we share our latest progress, key achievements, and the challenges we're working to overcome as we advance toward our net-zero ambition. The report highlights the partnerships and actions helping turn ambition into measurable impact. Explore the plan:

Every AI breakthrough starts with a materials breakthrough: 🔹1940s–70s: Germanium and silicon refinements make the first transistors possible, laying the base for computing. 🔹1970s–00s: Material scaling shrinks transistors and powers everyday digital tech. 🔹2000s–10s: Atomic-scale materials and FinFETs unlock processing power for early Machine Learning. 🔹2020s: Innovations in advanced logic, memory, and packaging fuel the Generative AI revolution. Where will the next materials breakthrough take us?

What does life as an ASM Process Engineer look like? "In this field, every failure moves you forward." Process engineering at the atomic scale isn't about getting it right on the first try—it's about iterating through complex problems until you unlock a breakthrough. 🚀 Jéssica Cimada , Process Development Manager at ASM, shares her journey in atomic layer deposition (ALD), problem-solving in the angstrom era, and what drives her every day. Read Jessica’s full story : https://lnkd.in/gs8PQHm4

Field engineering isn’t always about big machines-at ASM, it’s about atomic-scale impact. A 0.1 second tweak or a 0.1 nm adjustment can unlock entirely new possibilities. For Field Process Engineers like Silvia, precision at the atomic scale is where real problem-solving begins. From tuning processes at sub-nanometer dimensions to launching first-of-their-kind tools, every tiny adjustment drives massive innovation. Think fab work is just routine maintenance? Think again. Join our team : https://lnkd.in/gySE6Y3F

3D logic scaling doesn’t come free. Every leap in performance brings trade-offs in heat, power leakage, and yield reliability.     As nodes shrink, where should the industry focus its energy?    Cast a vote and drop your take in the comments⬇️    POLL:  The biggest challenge facing the future of microchips?    1) Raw speed  2) Power efficiency   3) Yield & reliability   4) Balancing all three  

Most people think the biggest GAA challenge is the architecture. But the real test lies in the materials challenges required to make GAA a success. Can you guess what the biggest challenge is? Comment your answer (A, B, C or D) below ⬇️ Then swipe to the last slide to reveal the answer. 

At ASM, we’re rethinking how performance is maintained with precision engineered into every step. Circularity in the semiconductor industry is often reduced to recycling. We challenge that view embedding circularity much sooner in our products’ lifecycle. See Chris’ s latest insight on sustainable cleaning. Read the full story → https://lnkd.in/g_KZc4RM

A leaking tap is easy to ignore 🚰 But imagine billions of them running at once? That’s a massive energy drain. In modern chips with tens of billions of transistors, off-state current leakage isn't a small detail—it's one of the semiconductor industry's biggest power efficiency bottlenecks. As scaling continues, mitigating current leakage is central to meeting global demand for energy-efficient electronics. It's the primary driver behind new 3D architectures like Gate-All-Around (GAA). See how ASM powers the future of energy-efficient chips: https://lnkd.in/euVWi2YM

Where does AI really begin? Long before the coding. Long before the silicon. Decades of material innovation are what today’s AI models were built on. Behind every breakthrough AI algorithm is a chain of hardware advancements—down to the transistors, materials, and engineering at the atomic level. Without material innovation, the next generation of chip performance simply isn't possible. At ASM, we help enable the material progress that supports cutting-edge chip performance and powers the future of AI. Want to work on technology that powers the future before anyone else even sees it? 👉 Build what’s next. Join ASM.

🧩 Think you know semiconductors? Prove it. Test your industry knowledge with our crossword challenge and share your answers in the comments. Then head to our latest blog artilcle to see how you scored. Across : 2. Atomic Layer ___: Precision atomic layering mechanism 4. Unwanted current flow that reduces device efficiency Down : 1. Key component of PECVD where films are formed through a gas-phase chemical process. 3. Process of protecting surfaces from environmental or electrical damage. 5. Materials used to isolate and control electric fields in devices. 🔍 How many can you solve?